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BARplast

Katy,  TX 
United States
http://www.barplast.com
  • Booth: 1937

BARplast LLC - High Performance Polymers.

Overview

BARplast LLC is based in Texas and is part of the BIEGLO-Group which is headquartered in Hamburg, Germany. BARplast is specialized in granules, powders and semi-finished high performance polymers. We focus on high temperature POLYIMIDE: Aurum ® (thermoplastic PI) , various thermosetting PI-s, such as PLAVIS.  PEEK: PEEK compounds and R-PEEK recycled material. We work together with Mitsui Chemicals Inc., Daelim Co. Ltd., LEHVOSS, and other leading manufacturers from around the world. Moreover, we offer PAI, PBI, PEI polymers suitable for your electronics and semiconductor industry applications in the form of raw-material, semi-finished and finished parts. Feel free to contact us!


  Press Releases

  • BARplast LLC, a distributor of high-performance plastics, will exhibit in SEMICON West 2023.

    BARplast will showcase its latest products, including AURUM®, a Thermoplastic Polyimide (TPI)  from Mitsui Chemicals, PBI, PIs Thermosetting Polyimide, and PEEK, during the event.

    AURUM®  is a high-performance thermoplastic with Properties such as low outgasing, high purity, excellent tribological properties, compounds can help prevent particle contamination and achieve more reliable wafer handling, storage and transfer. AURUM® is used in the semiconductor industry for sealing ICs, wafer bonding, manufacturing test sockets, and as a substrate element for high-performance PCBs. Its reliability, durability, and exceptional performance make AURUM® a sought-after Polymer in demanding electronic applications. This innovative Polyimide has a glass transition temperature (Tg) of 245°C (473°F) making it perfect for demanding applications in hot environments.

    Polybenzimidazole (PBI) is a thermoplastic polymer. This material is characterized by a glass transition temperature of 800 °F and a broad chemical resistance.

    In the Semiconductor industry, the thermoplastics can be used as retaining rings, screws, feeder rings, wafer handling, wafer spin chucks, furnace ring holders, focus rings, wafer clamps, vacuum pads, and wafer carriers.

    Thermosetting Polyimide series manufactured by DAELIM PLAVIS Co. Ltd., offers dimensional stability at high temperatures and is a versatile choice because it is lighter than metals and more flexible than ceramics. It finds successful applications in wafer processing and features ultra-clean composition, low outgassing, low dielectric constant, easy machinability, and very high distortion temperature. The High-purity of this Polyimide makes it an ideal choice for various Semicon applications.

    BARplast also offers several grades of PEEK compounds, which has proven to be compelling Polymers in the semiconductor industry. Thanks to their higher wear resistance, CMP rings made of PEEK can run up to twice as long as PPS before they need to be replaced.

    BARplast sells granules, powder, Semi-finished and finished parts of high performance polymers. BARplast has a global network of High Perfromance Polymers suppliers.

    BARplast will be exhibiting at SEMICON West from July 11-13, 2023, at the Moscone Center in San Francisco. Attendees are invited to visit the BARplast booth #1937 to learn more about the High Performance Polymer portfolio.

    About BARplast:

    About BARplast:

    BARplast is a subsidiary of BIEGLO Group a distributor of high -performance plastics based in Hamburg, Germany. With over 10 years of experience BIEGLO is serving a wide range of industries, including aerospace, automotive, electrical and more.

    BIEGLO Group endeavours to offer their range of special HPP products to its global customers by running generic web-shops as www.PEEK-shop.com , www.POLYIMIDE-shop.com , www.PAI-shop.de and www.PBI-shop.de,

    For more information, visit  www.BARplast.com


  Products

  • AURUM THERMOPLASTIC POLYIMIDE
    AURUM® is a thermoplastic polyimide manufactured by MITSUI Chemicals Inc. It comes in granules or powder and is used in the semiconductor industry for sealing ICs, wafer bonding, manufacturing test sockets, and as a substrate for high-temperature PCBs....

  • AURUM TPI is characterized by an excellent chemical resistance profile that makes it suitable for scenarios exposed to high levels of aggressive chemicals. Various sizes of rods, tubes, sheets, and films can be obtained by extrusion process with AURUM having an outstanding Tg of 473°F.

    AURUM® is widely used in various industries, including semiconductors, such as sealing integrated circuits (ICs), making interconnects, and constructing protective enclosures.

    In wafer bonding, its shortened coefficient of thermal expansion helps reduce pressure on the wafer, which protects against deformation or breakage.

    AURUM facilitates the electrical connection between the test equipment and the device/component under test (DUT) in manufacturing test sockets for semiconductor components. In addition, AURUM TPI is an excellent source of reliable and durable test sockets due to its superb oxidation latency and heat resistance.

    AURUM can also be used in electronics as a substrate element for higher-performance printed circuit boards in semiconductor. Its thermal resistance, combined with its low absorption capacity, makes it ideal for this application.

    Mitsui Chemicals Inc. manufactures TPI AURUM®, thermoplastic Polyimide powder, and granule (TPI), in Japan. BARplast is the official distributor of this material in the USA, in raw-material, semi-finished, and finished forms. The mother company of BARplast, BIEGLO GmbH in Germany, is the official distributor appointed for the EU, including Switzerland and the UK. Accessibility to this Ultra High-Performance Polymer through BARplast will open new opportunities for this product at the top of the polymer pyramid.

    BARplast is also acknowledged in the plastics industry for its PEI (Polyethyleneimine) and PBI (Polybenzimidazole). Polybenzimidazole (PBI) is one of the highest-performing engineering thermoplastic materials. This substance is known for having a glass transition temperature of 800.6 °F and a broad chemical resistance.

    Dexnyl© PEI is a thermoplastic material characterized by its excellent thermal performance with continuous use at higher temperatures. PEI polymer is known for its exceptional performance, including a robust strength-to-weight ratio and the ability to retain its strength up to 390°F (200°C). It also has excellent long-term resistance to thermal oxidation, good electrical properties, and inherent resistance to chemicals and flames.

    In the Semiconductor industry, thermoplastics are used as retaining rings, screws, feeder rings, wafer handling, wafer spin chucks, furnace ring holders, focus rings, wafer clamps, vacuum pads, and wafer carriers.

    BARplast aims to provide its exclusive range of HPP products to customers worldwide through the operation of general online stores, like. www.PEEK-shop.com, www.POLYIMIDE-shop.com, www.PAI-shop.com, and www.PBI-shop.com. Detailed information about the standardized HPP products can be found on these websites and www.BIEGLO.com

  • THERMOSETTING POLYIMIDE (PI)
    Thermosetting Polyimide PLAVIS N & S series offers stability at high temperatures and is a versatile choice because it is lighter than metals and more flexible than ceramics. The High-purity of this material makes it ideal for SEMICON applications....

  • Thermosetting polyimides, PI-s, are the highest temperature-resistant polymers commercially available. PLAVIS 'S' of Daelim Co., Ltd. presents a portfolio of aromatic polyimides with improved resistance to heat, wear, mechanical abrasion, radiation, and chemicals. Thanks to its improved properties, PLAVIS 'S' is suitable for use in highly demanding and cutting-edge mechanical, electrical/electronics, chemicals, automobiles, space, and aviation applications.

    PLAVIS has proven successful: Retaining rings, retaining screws, feeder rings, wafer handling, wafer spin chucks, furnace ring holders, focus rings, wafer clamps, vacuum pads, and wafer carriers. It finds successful applications in wafer processing and features ultra-clean composition, low outgassing, low dielectric constant, easy machinability, and high distortion temperature.

    PLAVIS 'N' bushings support high-voltage electrodes in semiconductor process chambers. They withstand harsh environmental conditions while maintaining high cleanliness in the chamber.

    Ultra-clean composition, low outgassing, low dielectric constant, easy machinability, and temperature resistance of up to 500°C (932°F) account for some of the unique features of thermosetting Polyimide material.

    BARplast offers high-performance polymer semi-finished shapes and finished parts through CNC machining, injection molding, compression molding, direct forming, and tailor-made production processes.

    BARplast also offers Direct formed parts from the Polyimide 'MELDIN 7000 series manufactured by Saint-Gobain. Other high-temperature temperatures thermosetting Polyimides like VESPEL and unique grades with low water absorption can be found through BARplast. BARplast sells ultra-high temperature resistant thermosetting polyimide (PI-s) products under the Dexnyl© PI-s series, with heat deflection temperature values ranging from 680°F to over 932°F.

    BARplast offers Films from 6μm up to 2000μm (0.3 mils up to 78 mils) with widths up to 1500 mm (59″) or cut to size and Sheets starting from 1mm (39.4 mils) thickness. Thermosetting PI rods OD from 0.24″- 3.3″ along with directly formed tubes from Meldin®, Vespel®, Plavis®, and other PI materials. Thermoplastic Polyimide Rods OD: 0.24″- 2.4″ and Tubes OD: 0.4″- 4″ are available to be offered. PAI sizes come in the range of Rod OD 0.1″- 10″ and tubes OD up to 4″. Polyimide sheets are available in sizes 12 x 12 inches (305 x 305mm) and with thicknesses of 1/16 inch (1.6mm) to 2 inches (50.8mm).

    BARplast offers a unique proposition of High-Performance Polymers. General thermosetting Polyimides like 'MELDIN® 7000-Series from Saint-Gobain, 'VESPEL' from DuPont, and 'PLAVIS' from Daelim Co. Ltd., and thermoplastic Polyimide (TPI) 'AURUM®' from Mitsui Chemicals. Moreover, natural PIs powders and granules, Polyimide films, rods & sheets, compounds, recycled PI-s, and finished PI-s parts are also available.

    BARplast is also acknowledged in the plastics industry for its PAI (Polyamide-imide) products. Dexnyl© PAI (Polyamide-imide) semi-finished is characterized by its strength and better stiffness, especially at temperatures above 482°F (250°C).

  • PEEK, R-PEEK
    PEEK provides excellent wear resistance, chemical resistance, dimensional stability & low outgassing, making it a reliable choice for wafer processing and other critical semiconductor processes....

  • Dexnyl© PEEK outperforms most grades of PEEK and has proven to be a compelling material for the semiconductor industry. With higher wear resistance, CMP rings made of Dexnyl© PEEK can run up to twice longer than PPS before needing to be replaced. The PEEK is 100% recyclable and loses minimal properties after multiple heat treatments.

    PEEK is the best solution in critical semiconductor applications such as CMP retaining rings, RSPs, EUV pods, FOUPs, wafer carriers, test sockets, and more. Dexnyl© PEEK films are used in crucial semiconductor and display manufacturing applications such as wafer carriers and conveyor belts.

    Dexnyl© PEEK films are used in crucial semiconductor and display manufacturing applications such as wafer carriers and conveyor belts.

    At BARplast, we offer High-Performance LUVOCOM® PEEK Compounds. Conductive compounds have decisive advantages over metals or coatings: they provide excellent design freedom, the finished parts are lighter in weight, more accessible and less expensive to manufacture, and more robust.

    Heat dissipation of coil jackets or housings of hard disks and other mass data storage devices increases using thermally conductive LUVOCOM TC.

    Possible Applications:

    Wafer Carrier injection molded

    CMP Stop Edge Ring

    Batch Spray Chamber

    Gas Feed Flange machined

    Single Wafer Cleaner

    Properties such as wear and chemical resistance, dimensional stability, ESD, and low outgassing can help prevent particle contamination and achieve more reliable wafer handling, storage, and transfer.

    BARplast has PEEK Rods from OD 2″- 12″ and Tubes OD 0.4″- 118″´and offers PEEK shapes and finished parts along with LUVOCOM® PEEK compounds for tailored applications.

    BARplast also offers recycled PEEK. As a thermoplastic polymer, PEEK is straightforward to recycle as long as the waste is dry, clean, and of one brand. The R-PEEK possesses properties similar to virgin material at about half the price. In addition to natural R-PEEK, BARplast can also offer R-PEEK compounds on demand.

    The DEXNYL® Black PEEK Masterbatch allows the converter of PEEK-granules to change natural PEEK to a black color. The MB is produced to be used with any PEEK grade, regardless of viscosity or brand.


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